Convection Reflow Oven B22 B221-AC11
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Benchtop oven B22 B221-AC11 is used in single or small batch production for the process of melting solder paste in air.
Reflow is carried out by forced convection using a built-in heater. Automatic loading and unloading of printed circuit boards in the soldering zone is carried out using a movable table. After the completion of the process, the table goes outside.
Management is carried out using the built-in microcomputer with a touch screen. The temperature in the soldering zone is set and controlled by software and thermocouples.
Permissible maximum size of printed circuit boards is 340x430mm.
To control the furnace, a modern microcomputer with touch input is used. The intuitive software interface makes controlling the oven simple and straightforward. The main program window contains all the necessary controls, a graph of temperatures recorded by thermocouples, the “Start” and “Stop” buttons, etc.
Price from 365 000 rub.
Length | 1390 mm |
Width | 770 mm |
Height | 370 mm |
Weight | 100 kg |
Type of heater | Forced convection |
Maximum temperature | 260 °С |
The time of heating (output on mode of soldering) | 20 mines |
Maximum dimensions of printed circuit boards to be processed | 340х430 mm |
Power supply | 220V, 50Hz |
Power consumption | 1.5 kW, max 4 kW |
The program (interface)
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